On February 7, Shanghai microelectronics held the shipping ceremony of the first 2.5d/3d advanced packaging lithography machine, which was officially delivered to customers. According to the official wechat of Shanghai microelectronics, the products shipped this time are a new generation of advanced packaging lithography machines, which are mainly used in high-density heterogeneous integration fields such as high-end data center high-performance computing (HPC) and high-end AI chips, and can meet the advanced packaging application requirements of 2.5d/3d super large chip size. On September 18, 2021, Shanghai microelectronics has launched a new generation of large field of view high-resolution advanced packaging lithography machine. This type of lithography machine is mainly used in the field of high-density heterogeneous integration. It has the characteristics of high resolution, high lithography accuracy and large exposure field of view. It can help wafer level advanced packaging enterprises realize the application of multi chip high-density interconnection packaging technology and meet the application requirements of heterogeneous integration and large chip packaging size. Lithography machine is the key to the domestic chip neck. How will the shipment of China's first 2.5d/3d advanced packaging lithography machine affect the chip industry? In fact, the lithography machine can be divided into front channel lithography machine, back channel lithography machine and panel lithography machine. Among them, the most advanced and largest market is the front pass lithography machine, which is mainly used for wafer manufacturing, and the back pass lithography machine is mainly used for chip packaging. In other words, the 2.5d/3d advanced packaging lithography machine released this time can not be used for wafer manufacturing, but for subsequent packaging. Advanced packaging is not only the research and development focus of packaging manufacturers, but also wafer manufacturers such as TSMC and Intel pay special attention to advanced packaging. This is because in the era of post Moore's law, major wafer manufacturers no longer blindly pursue smaller linewidth, and improving system integration through advanced packaging is also a feasible way to improve chip performance. At present, it is not known which customer ordered the 2.5d/3d advanced packaging lithography machine of Shanghai microelectronics. In addition, it is worth mentioning that the Foxconn semiconductor high-end packaging and testing project held the entry ceremony of the first lithography process equipment on July 20, 2021. It is reported that this type of lithography equipment is Smee (Shanghai microelectronics) packaging lithography machine. Source: Official Website of Qingdao new nuclear core technology The main body of Foxconn semiconductor high-end packaging and testing project is Qingdao new core technology Co., Ltd. according to its official website, it plans to develop fan-out packaging technology for high-frequency chip packaging required by 5g communication. New fanout packaging technology fostrip developed by new core? Obtained the technical patent in 2018. At the same time, the new core will further develop hyper 2D (a heterogeneous integration technology with ultra-thin and high-density interconnection). (Xinhua News Agency)