The global semiconductor market will present eight major development trends in 2024

2023-12-14

The latest research by market research firm IDC shows that with the explosive growth of global demand for artificial intelligence (AI) and high-performance computing (HPC), as well as the recovery of demand in markets such as smartphones, personal computers, servers, and automobiles, the semiconductor industry will usher in a new wave of growth. The institution predicts that the semiconductor market will exhibit eight major development trends in 2024. The semiconductor market will recover in 2024. The reduction in production in the storage market in 2024 will drive up product prices, coupled with the increased penetration rate of high priced high bandwidth memory (HBM), these two factors will become the driving force for market growth. With the gradual recovery of the terminal market, the supply of AI chips is in short supply. It is expected that the semiconductor market sales will show a growth trend in 2024, with an annual growth rate of 20%. Advanced driving assistance systems and automotive entertainment systems drive the development of the automotive semiconductor market. Although the growth rate of the entire vehicle market is limited, there is a clear trend towards intelligent and electrified automobiles, which injects driving force into the semiconductor market. It is expected that the compound annual growth rate of advanced driving assistance systems will reach 19.8% in 2027, accounting for 30% of the automotive semiconductor market for that year. Driven by the intelligence and networking of automobiles, the compound annual growth rate of this sub sector reached 14.6% in 2027, accounting for 20%. More and more automotive systems will rely on chips, and the demand for semiconductors is steadily increasing. Expanding semiconductor AI applications to personal terminals. With the advancement of semiconductor technology, it is expected that more and more AI functions will be integrated into personal terminals by 2024, with the rise of AI smartphones, AI personal computers, and AI wearable devices. After the introduction of AI, personal terminals will have more innovative applications, and the demand for semiconductors will further increase. The destocking of IC design is gradually coming to an end. The IC design products in the Asia Pacific region are diverse and widely used worldwide. Although the market performance in 2023 is relatively flat due to the long process of destocking, the industry still shows resilience under multiple pressures and actively explores ways to innovate and break through. In addition to continuing to deepen their efforts in the field of smartphones, companies are also entering the AI and automotive application arena in order to adapt to the rapidly changing market environment. With the gradual recovery of the global personal terminal market, this sub sector will have new growth opportunities, and it is expected that the market growth rate will reach 14% in 2024. The demand for advanced wafer foundry processes is growing rapidly. The wafer foundry industry has been affected by market inventory adjustments, resulting in a significant decline in capacity utilization in 2023, especially in the demand for mature processes above 28nm. However, due to the rebound in demand for some consumer electronics and the boost in demand for AI, 12 inch wafer fabs have gradually recovered in the second half of 2023. With the accelerated development of leading enterprises and the gradual recovery of terminal demand, this sub sector will achieve double-digit growth in 2024. Mature process price competition will intensify. From the second half of 2023 to the first half of 2024, there will be a demand for de stocking of industrial control and automotive chips in the short term, and these two fields of chips will mainly focus on mass production of mature processes, which will allow mature process wafer foundries to regain bargaining power. The 2.5/3D packaging market is experiencing explosive growth. Semiconductor chip

Edit:Hu Sen Ming    Responsible editor:Li Xi

Source:XinhuaNet

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