According to Taiwan media reports, TSMC, a large foundry, plans to build five new plants in the world this year, including the Japanese Kumamoto wafer plant 23, which started construction in April this year. The plant is expected to be put into operation in 2024. It is reported that the total investment of TSMC Kumamoto plant in Japan will reach about US $8.6 billion, and the Japanese government will support about 40% of the cost. This will be the first project to receive subsidies from the 617billion yen public fund aimed at strengthening Japan's semiconductor industry. The second is that Taiwan, China Zhuke Baoshan 2nm wafer 20 factory successively started the land lease procedure in April this year, and it is generally expected to obtain the reserved land for 2nm factory in June. The third is Kaohsiung wafer 22 factory. On November 9 last year, TSMC announced the investment plan for Kaohsiung's new plant, which will build a 12 inch wafer plant in Kaohsiung to produce 7 nm and 28 nm processes. The plant is expected to start construction in 2022 and mass produce in 2024. The fourth is Nanke wafer 18 plant, where 3nm will enter mass production and subsequent expansion. The fifth is the mature process expansion of Nanjing wafer 16 factory. On June 8, TSMC said at the shareholders' meeting that TSMC has reserved $40-44billion for expansion and equipment upgrading, and it is expected to spend more than $40billion in these areas in 2023, so that TSMC can maintain rapid technological development and meet the most cutting-edge future needs. In addition, as early as 2021, TSMC said that it would invest $100billion in the next three years to improve its factory capacity to meet the growing demand of the chip market. At present, TSMC's capacity expansion plan will be carried out nonstop. (Xinhua News Agency)